SPUTTERING TARGETS

A sputtering target is a material that is used to create thin films in a technique known as sputter deposition or thin film deposition. During this process the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is known as the substrate (e.g. silicon wafer). Sputter deposition is commonly involved in the creation of semiconductors and computer chips. Most sputtering target materials are metallic elements or alloys, although there are some ceramic targets available that create hardened thin coatings for various tools.

Depending on the nature of the thin film being created, sputtering targets can very greatly in size and shape. The smallest targets can be less than one inch (2.5 cm) in diameter, while the largest rectangular targets reach well over one yard (0.9 m) in length. Some sputtering equipments will require a larger sputtering target and in these cases, segmented targets that are connected by special joints are used.

RotaLab offers a complete line of sputtering targets in a wide variety of sizes and materials, and in purities ranging from commercial grade (99.9% purity) to zone refined Ultra-Pure grade (99.999% purity).